A thermally conductive interface material with tremendous and reversible surface adhesion promises durable cross-interface heat conduction
作者：C. Guo, Y. Li, J. Xu, Q. Zhang, K. Wu*, Q. Fu*
關(guān)鍵字：Thermal interface material
論文來(lái)源：期刊
發(fā)表時(shí)間：2022年
Materials Horizons
