High-Performance Light-Emitting Diodes Encapsulated with Silica-Filled Epoxy Materials
作者：Tian Li, Jie Zhang, Huiping Wang, Zhongnan Hu, and Yingfeng Yu*
關(guān)鍵字：light-emitting diodes, epoxy packaging materials
論文來源：期刊
具體來源：ACS Appl. Mater. Interfaces 2013, 5, 8968-8981
發(fā)表時(shí)間：2013年
Packaging materials have a great impact on the performance and reliability of light-emitting diodes (LEDs). A set of evaluation methods have been established to characterize the reliability of LED devices. No delamination or internal cracking between packaging materials and lead frames has been found for the encapsulated high performance LED devices after the package saturation with moisture and subsequent exposure to high-temperature solder reflow and thermal cycling. The properties of epoxy packaging materials and LED devices were studied by differential scanning calorimetry (DSC), thermogravimetric analyses (TGA), dynamic mechanical analysis (DMA), thermomechanical analyzer (TMA), ultravioletvisible spectrophotometer (UV-vis), scanning acoustic microscopy (SAM), and scanning electron microscopy (SEM). The light transmittance of epoxy materials varied with fillers after UV and thermal aging.